Electronic assembly with thermally separated support
US6903271B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Sep 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3447
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.