Single metal programmability in a customizable integrated circuit device
US6903390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Oct 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A customizable integrated circuit including a substrate, a plurality of logic units formed on the substrate and a plurality of metal routing layers formed on the substrate for interconnecting the plurality of logic units. The plurality of metal routing layers includes a first routing layer including a plurality of elongate conductors extending generally in a given direction, a second routing layer including a plurality of transversely extending conductors, each adapted for interconnecting a termination of one of the plurality of elongate conductors to a beginning of another one of the plurality of elongate conductors and at least a third routing layer, including a plurality of local routing conductors, a plurality of customizable connections between pairs of the plurality of elongate conductors via individual ones of the plurality of transversely extending conductors and customizable connections between individual elongate conductors and a plurality of individual local routing conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.