Method and apparatus for synthesizing high-frequency signals for wireless communications
US6903617B2 · kind B2 · utility
5Cited by
79References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Feb 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.