Integrated, in-line bumping and exposure system
US6903809B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2004 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | May 25, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2055
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated, in-line bumping and exposure system for printing plates or other substrates having a photosensitive layer. A linear illumination source or sources are for bumping the photosensitive material with a band of illumination to consume dissolved oxygen within the photosensitive layer. A raster scan optical assembly or an illuminated and re-imaged spatial light modulator array exposes the photosensitive material with a rasterized beam or beams or an array of modulated electromagnetic radiation located downstream of the bumping illumination. A conveyance mechanism is configured to provide relative continuous motion between one or more substrates and the bands of illumination to continuously bump and pattern one portion of the plate or plates while the other portion of the plate or plates is bumped in anticipation of patterning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.