Circuit board construction for use in small form factor fiber optic communication system transponders
US6903934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Dec 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features separate transmitter and receiver ports and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A Flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board using ball grid arrays having overlapping attachment structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.