Methods for transferring supercritical fluids in microelectronic and other industrial processes
US6905555B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | May 30, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0324
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of displacing a supercritical fluid from a pressure vessel (e.g., in a microelectronic manufacturing process), with the steps of: providing an enclosed pressure vessel containing a first supercritical fluid (said supercritical fluid preferably comprising carbon dioxide); adding a second fluid (typically also a supercritical fluid) to said vessel, with said second fluid being added at a pressure greater than the pressure of the first supercritical fluid, and with said second fluid having a density less than that of the first supercritical fluid; forming an interface between the first supercritical fluid and the second fluid; and displacing at least a portion of the first supercritical fluid from the vessel with the pressure of the second, preferably fluid while maintaining the interface therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.