Method of embedding optical fiber in multilayer printed circuit board
US6905569B2 · kind B2 · utility
6Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Jan 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09036
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is disclosed a method of embedding an optical fiber in the miltilayer printed circuit board without causing chemical or thermal damage to the optical fiber, in which a groove is formed on a substrate consisting of a dielectric substrate layer having a conductive layer formed on one side thereof, for example by a router bit process, the optical fiber is embedded in the groove using an adhesive liquid to give a optical substrate, and then at least one printed circuit board is laminated on and under the single optical substrate or the layered structure of two or more of the optical substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.