Dispersion for chemical mechanical polishing

US6905632B2 · kind B2 · utility

Assignee

• Degussa AG · DE

Inventors

• Wolfgang Lortz · Wächtersbach, DE
• Christoph Batz-Sohn · Hanau, DE
• Gabriele Perlet · Großkrotzenburg, DE
• Werner Will · Gelnhausen, DE

Key dates

• Filing date: Jan 31, 2003
• Grant date: Jun 14, 2005
• Expiry date: Apr 10, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31053
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

An aqueous dispersion is used in the chemical mechanical polishing of surfaces, particularly oxidic surfaces, such as silicon dioxide. The aqueous dispersion contains a powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide, relative to the total amount of powder, said powder having an average particle diameter in the dispersion of not more than 0.1 μm.