Epoxy resin composition and electronic part
US6905768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2001 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Jan 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The epoxy resin of the invention comprises (A) an epoxy resin, (B) at least one member selected from the group consisting of a phenolic hydroxyl group-containing compound, a urea resin and a melamine resin, (C) a crosslinked phenoxyphosphazene compound, and (D) an inorganic filler powder, the amount of component (C) being in the range of 0.01 to 30 wt. % based on the total amount of components (A), (B) and (C), and the amount of component (D) being in the range of 60 to 98 wt. % based on the total amount of components (A), (B), (C) and (D). The epoxy resin composition of the invention and a molded product are halogen-free and antimony-free and are excellent in flame retardancy. When an element for an electronic part such as LSI and VLSI is encapsulated by the epoxy resin composition of the invention, the obtained electronic part is outstanding in heat resistance, moisture resistance, thermal impact resistance and like properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.