Microwave bonding of MEMS component

US6905945B1 · kind B1 · utility

Assignee

• CALIFORNIA INSTITUTE OF TECHNOLOGY · US

Inventors

• Martin B. Barmatz · La Cañada Flintridge, US
• John Mai · La Cañada Flintridge, US
• Henry W. Jackson · La Verne, US
• Nasser Budraa · Verdugo City, US
• William T. Pike · London, GB

Key dates

• Filing date: Apr 20, 2000
• Grant date: Jun 14, 2005
• Expiry date: Apr 20, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C3/001
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.