Apparatus and method for improving AC coupling on circuit boards
US6905979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Apr 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.