Semiconductor device module
US6906316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Dec 19, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/34
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device module is provided that prevents adhesion defects from causing in bonding a semiconductor sensor chip to a sensor stage with an adhesive and improving the reliability thereof. The semiconductor device module includes a sensor stage and a semiconductor optical sensor chip mounted on the sensor stage. The sensor stage includes a U-groove formed in an upper central surface portion of a bottom wall thereof. The sensor chip is bonded to the sensor stage with a thermosetting and UV-curing adhesive coated in the U-groove. The U-groove, includes an island-shaped flat pedestal located at a central bottom portion of the U-groove for mounting the sensor chip thereon. Pins are preferably disposed on both sides of the pedestal to hold the sensor chip horizontally, and the side walls of the U-groove 3b are preferably slanted such that the adhesive coated in the U-groove is prevented from splashing to the outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.