Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
US6906425B2 · kind B2 · utility
29Cited by
13References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2002 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Mar 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249985
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated at solder reflow temperatures to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.