Inverter apparatus and method of manufacturing the same
US6906935B2 · kind B2 · utility
3Cited by
1References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 12, 2002 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Nov 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an inverter apparatus in which a three-phase inverter main circuit having a plurality of arms comprises a plurality of semiconductor chips for electric power, one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected in parallel, while the IGBTs and the diodes are bonded to a conductor having a thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler through an insulating resin sheet containing ceramics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.