Optical coupling for a flip chip optoelectronic assembly
US6907151B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 24, 2002 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Dec 1, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/43
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A flip chip optoelectronic device assembly includes a hollow, cylindrical spacer between an optical source in the substrate and the active surface of the chip, which precludes attenuation of the signal and allows direct transmission through air. An underfill material fills the space between chip and substrate, thereby allowing substrates which are not necessarily matched in thermal expansion to the chips, and the spacer acts as a dam to prevent ingress of underfill material into the optical path. The spacer not only allows use of conventional underfill materials to support the interconnection joints and thermal mismatch, but also defines a fixed “z” axis distance between substrate and chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.