Micromechanical inertial sensor

US6907782B2 · kind B2 · utility

Assignee

• EADS Deutschland GmbH · DE

Inventors

• Konrad Lentner · Mintraching, DE
• Stefan Sassen · Munich, DE
• Josef Schalk · Riedlingen, DE

Key dates

• Filing date: Nov 30, 2001
• Grant date: Jun 21, 2005
• Expiry date: Nov 30, 2021

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0831
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical inertial sensor that includes three component planes, namely a bottom part, a center part and a cover part. The center part is a silicon wafer in which a cardan-type (i.e. gimbal) structure with two oscillating elements is formed. A plate is formed in the silicon wafer which can be pivoted about a rotational axis lying in the wafer plane. Metallized portions or conductive layers form an exciter unit and set the gimbal structure oscillating. The inventive sensor further comprises a device for detecting the displacement of the plate. In addition, a method for manufacturing a micromechanical inertial sensor.