Surface acoustic wave pressure sensor with microstructure sensing elements
US6907787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Apr 30, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.