Devices for dissipating heat in a fluid ejector head and methods for making such devices
US6908170B2 · kind B2 · utility
11Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2003 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/08
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejector assembly includes a container that stores a fluid to be ejected, a heat sink attached to the container, and a die module bonded to the heat sink. The heat sink is molded from a polymer that has at least one thermally conductive filler material mixed into the polymer. The heat sink is shaped to dissipate heat. The fluid ejector assembly is manufactured by mixing the at least one thermally conductive filler material with the polymer, molding the heat sink using the polymer and thermally-conductive filler material mixture, and attaching the heat sink to a die module and, optionally, to a fluid-containing container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.