Process and apparatus for embossing precise microstructures and embossing tool for making same
US6908295B2 · kind B2 · utility
69Cited by
69References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2001 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Jun 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process and apparatus for embossing thermoplastic products having precise microstructured surfaces including using a continuous press having upper and lower belts with the embossing pattern(s); feeding thermoplastic material through the press where heat and pressure are applied to form the embossed pressure microstructure, and cooling the embossed material, all while maintaining pressure. A continuous embossing tool is provided by welding segments together, the welds including interface material at the weld joint which is of a different material than the segment material to increase the tensile strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.