Rinse apparatus and method for wafer polisher
US6908370B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2003 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Dec 4, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.