Microneedle devices and methods of manufacture
US6908453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | May 1, 2022 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61M2037/0053
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Microneedle devices and methods of manufacturing the microneedle devices. The microneedle devices include microneedles protruding from a substrate, with the microneedles piercing a cover placed over the substrate surface from which the microneedles protrude. The cover and the microneedle substrate together define a capillary volume in fluid communication with the base of each microneedle. One manner of using microneedle arrays of the present invention is in methods involving the penetration of skin to deliver medicaments or other substances and/or extract blood or tissue. Manufacturing methods may include simultaneous application of pressure and ultrasonic energy when piercing the cover with the microneedles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.