Process for manufacturing an evaporation source
US6908588B2 · kind B2 · utility
4Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Jan 29, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a process for manufacturing an evaporation source for physical vapor deposition. The evaporation source is formed of the actual sputtering target with an aluminum component and one or more further components as well as of a backing plate made from a material having better thermal conductivity than the target. The backing plate made of a powdery starting material is pressed, together with the powdery components of the sputtering target, into sandwiched powder fractions and then formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.