Promoting adhesion between a polymer and a metallic substrate
US6908684B2 · kind B2 · utility
2Cited by
33References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2004 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.