Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
US6908685B2 · kind B2 · utility
14Cited by
19References
8Claims
0Family size
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Inventors
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Dec 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.