Spherical semiconductor device and method for fabricating the same
US6909182B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Jun 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical bumps constituting a group to be connected to the outside protrude above the spherical semiconductor element such that a predetermined gap is formed between a plane or a spherical surface capable of contacting the spherical bumps and the surface of the spherical semiconductor element. The spherical semiconductor device is connected to various circuit boards or another semiconductor device through the spherical bumps. This affords easy and accurate electrical connections to the outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.