Package structure of a composite LED
US6909234B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Jun 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure of a composite LED is to package an LED chip into a SMD LED package subbody component. Then, a single SMD LED package subbody component or multiple SMD LED package subbody components may be packaged into a large sized recessed package mother body, thereby forming the package structure of a composite LED. Thus, the quality is better, and the color shift is less, thereby enhancing the quality of production, and thereby decreasing the cost of production. In addition, the SMD LED may be previously classified according to the features, and may then be packaged into the mother body, thereby obtaining better features, such as Vf, color, brightness or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.