Electronic pressure sensitive transducer apparatus and method for manufacturing same
US6909354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Mar 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.