Thermally matched fluid cooled power converter
US6909607B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Oct 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.