Patent · US Expired

Method and apparatus for on-wafer testing of an individual optical chip

US6909830B2 · kind B2 · utility

13Cited by

4References

33Claims

0Family size

Assignee

Enablence Inc. · CA

Inventors

Kevin Lee · Cambridge, US
Christian Hoepfner · North Andover, US
Desmond Lim · Cambridge, US
Wang-Yuhl Oh · Daejeon, KR

Key dates

Filing date	Nov 15, 2002
Grant date	Jun 21, 2005
Priority date	—
Expiry date	Dec 17, 2022

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/4214
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. Inserting a probe at the access point to optically couple the optical probe and optical chip. The optical probe includes at least a first optical waveguide for changing the direction of input light at the probe to optically couple with the optical chip at the access point.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.