Substrate and method of forming substrate for fluid ejection device
US6910758B2 · kind B2 · utility
6Cited by
20References
56Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2003 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Dec 31, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced stops in the first side of the substrate, partially forming a first portion of the opening in the substrate from the second side by a first process, further forming the first portion of the opening in the substrate from the second side by a second process, including forming the first portion of the opening to the spaced stops, and forming a second portion of the opening in the substrate from the first side, including forming the second portion of the opening between the spaced stops.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.