Method for plating electrodes of ceramic chip electronic components
US6911138B2 · kind B2 · utility
4Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Apr 24, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.