Methods and systems for forming slots in a substrate
US6911155B2 · kind B2 · utility
3Cited by
36References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Jun 3, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1632
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.