Patent · US Expired

Method for manufacturing semiconductor device

US6911358B2 · kind B2 · utility

36Cited by
53References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 27, 2002
Grant dateJun 28, 2005
Priority date
Expiry dateDec 27, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D86/0229
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for manufacturing a semiconductor device having steps of forming an amorphous semiconductor on a substrate having an insulating surface; patterning the amorphous semiconductor to form plural first island-like semiconductors; irradiating a linearly condensed laser beam on the plural first island-like semiconductors while relatively scanning the substrate, thus crystallizing the plural first island-like semiconductors; patterning the plural first island-like semiconductors that have been crystallized to form plural second island-like semiconductors; forming plural transistors using the plural second island-like semiconductors; and forming a unit circuit using a predetermined number of the transistors, where the second island-like semiconductors used for the predetermined number of the transistors are formed from the first island-like semiconductors that are different from each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.