Curing agent composition for epoxy resins, epoxy resin composition and use thereof
US6911503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Apr 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a curing accelerator (C), wherein the curing agent (B) is a phenol compound having two or more hydroxyl functional groups or a compound obtained by esterification of the phenol compound or a mixture of these compounds, and the curing accelerator (C) is a salt of a phosphazenium compound represented by a formula (I): (wherein R1s each represent a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aryl or aralkyl group having 6 to 10 carbon atoms and may be all the same or different from one another; and Z− represents a halogen anion, hydroxy anion, alkoxy anion, aryloxy anion or carboxy anion).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.