Flexible printed circuit
US6911605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Apr 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to provide low-cost, long fatigue life flexible printed circuit, low profile electrolytic foil is used as copper foil for a circuit 3 of the flexible printed circuit 10. Crack which does not penetrate the copper foil should preferably be formed on the low profile electrolytic foil. For methods to form cracks on the low profile electrolytic foil, methods such as pre-bending and etching can be employed. Due to the weakness of the low profile electrolytic foil, the base film 1, the cover layer 5, and the bonding agent 2, 4 which are disposed on the both sides of the low profile electrolytic foil should preferably be plastic film of which elasticity ratio is equal to 108 Pa or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.