System and method for unveiling targets embedded in a multi-layered electrical circuit
US6911620B2 · kind B2 · utility
5Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Sep 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for unveiling embedded targets in printed circuit board substrates includes a micro-machining device, a sensor, and a controller. The micro-machining device removes portions of an opaque layer overlaying an alignment target in a general region in which the target should be located, and the sensor senses whether the alignment target is located at selected locations where portions of the opaque layer have been removed. In response to sensing the presence or absence of an alignment target at the selected locations, the controller directs the micro-machining device to remove additional portions of the opaque layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.