Member for electronic circuit, method for manufacturing the member, and electronic part
US6911728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Dec 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/38
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.