Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing

US6911834B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Scott W. Mitchell · San Jose, US
• Reynaldo Rincon · Richardson, US
• Jerry J. Broz · Longmont, US
• Gerard Laugier · Villeneuve-Loubet, FR

Key dates

• Filing date: Jan 25, 2002
• Grant date: Jun 28, 2005
• Expiry date: Feb 26, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/07314
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Apparatus and methods for testing conductive bumps or target test points on integrated circuits. A multiplicity of probes are extended through a support substrate. At least one of the multiplicity of probe locations include a second electrically isolated probe such that the test point is in contact with two probes. One of the two probes provides a voltage to the test point and the second probe sensing the voltage so as to provide a Kelvin connection.