Electrostatically actuated micro-electro-mechanical devices and method of manufacture

US6912078B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Thomas Kudrle · Cambridge, US
• Carlos H. Mastrangelo · Andover, US
• Marc Waelti · Salem, US
• ChuanChe Wang · Horseheads, US
• Gordon M. Shedd · Lawrenceville, US
• Gregory A. Kirkos · Seattle, US
• Mirela G. Bancu · Somerville, US
• James C. Hsiao · Watertown, US

Key dates

• Filing date: Mar 15, 2002
• Grant date: Jun 28, 2005
• Expiry date: Jul 21, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S359/904
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices. Other embodiments are directed to methods of depositing a thin film on the back of a MEMS device.