Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus
US6912785B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 2001 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Jan 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49362
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A notebook computer has a base housing with a heat-generating microprocessor therein, and a lid housing pivotally connected to the base housing. Operating heat from the microprocessor is transferred to the lid housing, for dissipation therefrom, via a specially designed thermosyphoning heat pipe structure formed from first and second heat pipes. The first heat pipe representatively has a rectangular cross-section, an evaporating portion thermally communicated with the microprocessor, and a coiled condensing portion centered about the lid hinge line and having a circularly cross-sectioned interior side surface portion defined by flat sides of the first heat pipe. The second heat pipe has a circular cross-section, an evaporating portion pivotally received within the coiled first heat pipe portion, and a condensing portion thermally communicated with the lid housing. When the lid housing is opened and closed, the evaporating portion of the second heat pipe is rotated within the coiled first heat pipe portion and slidably engages its circularly cross-sectioned interior side portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.