Lamination system
US6913055B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2004 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lamination system comprises a thermocompression bonding means for bonding laminate films on top and/or back surfaces of cards, applying heat and pressure using a pair of heat rollers. The lamination system is provided with contact type temperature detection devices for detecting surface temperatures of the heat rollers and a heat roller attaching/detaching device for attaching or detaching the heat rollers. The heat roller attaching/detaching device places the temperature detection devices in contact with surfaces of the heat rollers when the heat rollers are being installed in the lamination system, and places the temperature detection devices apart from the heat rollers when the heat rollers are to be attached to, or detached from, the lamination system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.