Cooling device having fins arranged to funnel air
US6913069B2 · kind B2 · utility
8Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2003 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Aug 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.