Planar heat pipe structure
US6913070B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Sep 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An improved structure of a planar heat pipe, having a top lid and a bottom lid. The bottom lid can be engaged with the top lid. A wick structure and a working fluid are installed in the heat pipe. The top lid has a top panel, which has a central flat area and a plurality of independent heat dissipating fins spirally arranged around the flat area. Each of the heat dissipating fins has a cone shape, and the height of the heat dissipating fins gradually increases from the center to the periphery of the top lid. A spiral heat circulating path is thus formed on the top lid. Thereby, when the cooling fan generates cooling air flow downwardly, an air impingement is formed upon the flat region of the top lid. The heat accumulated in the central flat region is then dissipated by the heat dissipating fins with an enhanced efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.