Method and apparatus for thermally investigating a material
US6913383B2 · kind B2 · utility
5Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2003 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Jun 9, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/4866
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for thermally investigating a material by driving the material through a temperature profile composed of isothermal and non-isothermal segments is disclosed, which enable determination of a kinetic component in a measured heat flow signal caused by the exposure of the material to the temperature profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.