Low amplitude, high speed polisher and method
US6913528B2 · kind B2 · utility
7Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2001 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Mar 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optionally at least one additional polishing motion selected from rotational, oscillating, sweeping, orbital and linear polishing motions. As a result, polished workpieces, such as semiconductor wafers, have reduced surface defects, improved planarity, and are polished more uniformly over a wider area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.