Diode-laser curing of liquid epoxide encapsulants
US6913794B2 · kind B2 · utility
9Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Nov 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/284
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of encapsulating an integrated-circuit component supported on a substrate comprises depositing on the component a thermally curable liquid organic matrix in sufficient quantity to form a layer covering the component. The liquid matrix layer is irradiated by laser radiation having a wavelength between about 600 and 1000 nanometers. The liquid matrix includes one or more additive materials that are strongly absorbing for the wavelength of the laser radiation. The liquid matrix layer is irradiated with the laser radiation for a time period sufficient to cure the matrix layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.