Heat conductive material
US6914025B2 · kind B2 · utility
8Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2001 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Nov 6, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of such materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles silicone carbide and silicon and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm2/s.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.