Patent · US Expired

Thermoreactive hot-melt adhesives

US6914102B2 · kind B2 · utility

1Cited by

2References

13Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

Olaf Kleineberg · Wuppertal, DE
Engin Temeltas · Wuppertal, DE
Heinz-Peter Pfeiffer · Wuppertal, DE

Key dates

Filing date	Nov 21, 2003
Grant date	Jul 5, 2005
Priority date	—
Expiry date	Jan 2, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31591
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A thermally curable hot-melt adhesive composition, comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.