Thin-film semiconductor epitaxial substrate having boron containing interface layer between a collector layer and a sub-collector layer
US6914274B2 · kind B2 · utility
2Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2003 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Mar 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/136
Abstract
A thin-film semiconductor epitaxial substrate comprising a substrate and a sub-collector layer, a collector layer, a base layer and an emitter layer(s) which are formed as thin-film semiconductor epitaxial layers on said substrate, wherein boron (B) added is present in at least a part of a layer portion comprising said sub-collector layer and said collector layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.