Patent · US Expired

Heat sink formed of diamond-containing composite material with a multilayer coating

US6914330B2 · kind B2 · utility

4Cited by

13References

10Claims

0Family size

Assignee

Plansee Aktiengesellschaft · AT

Inventors

Gunter Kneringer · Reutte, AT
Arndt Lüdtke · Reutte, AT

Key dates

Filing date	Sep 23, 2003
Grant date	Jul 5, 2005
Priority date	—
Expiry date	Dec 24, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/30
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module serves as a heat sink for semiconductor components. The module includes a diamond/composite substrate that carries a multilayer coating on at least one substrate surface and a housing frame made from ceramics which is soldered onto the substrate. The module excellently fulfills the demands imposed on it, namely a good ability for areally joining to the semiconductor component, a high heat transfer through the joining zone and a good electrical conductivity of the module in the joining zone.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.